Thinnest iPhone Ever: iFixit Teardown Reveals iPhone Air’s Secrets

According to iFixit, Apple’s newly released iPhone Air is the thinnest iPhone yet, measuring a mere 5.6mm in thickness, with its latest teardown detailing how Apple packed all essential components into such a slim chassis while maintaining durability and repairability.

The design uses a new “camera platform” that embeds part of the logic board within the raised camera module area, freeing space for a larger battery and strengthening the structure with a metal casing. iFixit notes that the titanium frame can be bent by hand when stripped of components, but becomes highly resistant to deformation once filled with parts, illustrating how the internal layout contributes to rigidity.

The teardown also highlights a single-layer component arrangement, clips-based screen and back cover attachment, and a battery held by a low-voltage release adhesive to ease replacement. Inside, the iPhone Air features Apple’s first in-house C1X 5G modem chip with the A19 Pro processor and N1 network chip, while the USB-C port is crafted from 3D-printed titanium alloy to suit the ultra-thin design. The iPhone Air’s preliminary repairability score is 7/10. 21 September 2025.